Vivek Dave subsurface heat distribution DARPA work
Appears in 1 lecture.
Appearances across the corpus
Under DARPA sponsorship in the early 1990s, Dave extended the Chai distributed-surface heat source to include heat distribution beneath the surface (surface depression effects). Cited as the last step in the lineage before finite-element methods made the analytical extensions obsolete.
In heat flow in welding, from Daniel Rosenthal to Nils Christensen to Nunsen Chai — Nunsen Chai is now number two person at Taiwan Semiconductor Manufacturing. So he didn't become the CEO of the world's largest silicon foundry, but he did a thesis looking at intensity of heat of gas tungsten arcs, and extending Rosenthal's dimensionless thing to a distributed heat source. There's another guy, Vivek Dave, in the early 90s under some DARPA sponsorship, basically took it and said, okay, rather than just having a distributed heat source on the surface, I can have surface depression and other things. What happens if I allow for heat distribution through the surface, down beneath the surface?