IBM System/360 mainframe helium cooling

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SSW_S2013_12 · Solid State Welding, Spring 2013 · §2.p2

In your laptop you're running at two percent duty cycle or so, but in a high duty cycle application — number-crunching in a supercomputer — we're limited by the heat we generate. We're limited by lots of things, including the frequency, how fast you can operate the computer. But one of the things you're limited by is the amount of heat you can generate and pull out of there. IBM, for their 360 mainframe, had gaseous helium going in among the chips. The whole thing was sealed and they had a heat exchanger with gaseous helium.